- semiconductor wafer cutting
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| Model： | 28492000 | |||
| Origin： | China | |||
| Category： | > Industrial Supplies > Abrasives | |||
| Keywords： | semiconductor cut abrasive powder aluminium oxide cutting polishing silicon carbide sell | |||
| Price： | U.S. Dollar /MT T/T | |||
| Min. Order： | 1 / MT | |||
- Product Description
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Exclusive micro-powder for semiconductor wafer cutting
Kind: Green silicon carbide micro-powder, black silicon carbide micro-powder.
Size: F500 F600 JIS800-1500
Payment: L/C TT
Origin: China
Packing: plastic Bag or paper bag
Transportation: By Sea
- Product Image
- Contact Information of this Company
| Company Name︰ | Henan Xindaxin Science and Technology Co.,Ltd. | |
| Company Address︰ | 368,Hangzhou Road,Xushui Industry Zone, Zhengzhou,Henan,China | |
| Company Phone︰ | 86-371-67856969 | |
| Company Fax︰ | 86-371-67835269 | |
| Contact Person︰ | RoyChang ( marketing ) | |
| Mobile︰ | 86-13673975400 | |
| Website︰ | http://roygo.ec51.com | |
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